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Capabilities

Gorilla Circuits is one of the most capable PCB fabricators in the U.S. Our niche is advanced capability and critical delivery fabrication and assembly. All of Gorilla’s manufacturing is done in-house. Below are some of our key fabrication capabilities:

Core Competencies

  • Schematic Capture
  • Layout
  • Fabrication
  • BOM Generation
  • Parts Procurement
  • Circuit Board Assembly
  • Flying Probe Testing

Differentiators

  • Up to 60 Layers -> .300” max thickness
  • 34:1 Aspect Ratio (.006” diameter / .200” thick)
  • Single Lam .4MM Pitch capability
  • Fine pitch back-drilling on .4MM pitch DUT
  • 0.3MM Pitch on ATE, Daughter Cards, & Motherboards
  • 3 mil Minimum Laser Micro Via
  • 3 mil Minimum Mechanical Drill up to 35 mil thickness
  • 2.5 mil I/L trace width on .5oz Cu
  • 2.0 mil I/L trace to trace space on .5oz Cu
  • 2 mils per inch warp/twist on balanced constructions
  • 5% Impedance Control Tolerance
  • Up to 5 Lamination Cycles
  • HDI Build-up to 4+N+4
  • Via-in-Pad: Non-Conductive & Copper Fill